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Chip Testing: ChipStart Backs Groundbreaking Wafer Test Tech

Chip Testing: ChipStart Backs Groundbreaking Wafer Test Tech

NPL’s HIDRA Vision is revolutionizing the semiconductor industry with its groundbreaking wafer imaging technology. By capturing high-resolution images of semiconductor wafers in just a few minutes, HIDRA Vision is able to quickly identify defects and improve yield in compound semiconductor manufacturing. This technology has the potential to save hundreds of millions of pounds per year and overcome the limitations of traditional inspection methods.

In the quest for more sustainable manufacturing processes, NPL’s HIDRA Vision is a game-changer. By significantly reducing the time it takes to inspect semiconductor wafers and improving defect identification, this innovative technology can contribute to a more efficient and environmentally friendly production of compound semiconductors.

One of the key advantages of HIDRA Vision is its ability to capture high-resolution images with approximately two million points on the wafer. This level of detail allows for the correct identification of defects, ensuring that only high-quality wafers are used in the manufacturing process. Traditional inspection methods, which can take hours or even days, often miss material defects, leading to wasted resources and lower yields.

With the help of artificial intelligence (AI), HIDRA Vision has even more potential to unlock in inspection problems. By analyzing the high-dimensional information captured by the technology, AI algorithms can enhance defect identification and provide valuable insights for process optimization. This not only improves the quality of the manufactured semiconductors but also reduces waste and resource consumption.

The impact of HIDRA Vision goes beyond just improving manufacturing efficiency. By quickly measuring whole semiconductor wafers, this technology has the potential to save hundreds of millions of pounds per year. The time saved in the inspection process allows for faster production cycles and increased productivity, leading to significant cost savings for semiconductor manufacturers.

The development of HIDRA Vision has been made possible through the support of DSIT’s Government Office for Technology Transfer (GOTT). Through two Knowledge Assets Grant Fund grants, NPL was able to carry out a market study and build and test a full-scale prototype in various applications. GOTT’s support has been instrumental in advancing HIDRA Vision to its current point and bringing this innovative technology closer to commercialization.

In conclusion, NPL’s HIDRA Vision is a groundbreaking semiconductor wafer imaging technique that has the potential to revolutionize compound semiconductor manufacturing. By capturing high-resolution images in a fraction of the time compared to traditional methods, HIDRA Vision improves defect identification and increases yield. With the support of AI, this technology can further enhance inspection processes and contribute to more sustainable and efficient manufacturing practices. The support from DSIT’s GOTT has been crucial in the development of HIDRA Vision, bringing us one step closer to a more environmentally friendly semiconductor industry.

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Akash Osta